| HS Code | 357267 |
| Density | 1.24 g/cm³ |
| Melt Flow Rate | 10-14 g/10 min (210°C, 2.16 kg) |
| Tensile Strength | 60 MPa |
| Tensile Elongation At Break | 3.5% |
| Tensile Modulus | 3.3 GPa |
| Flexural Modulus | 3.6 GPa |
| Flexural Strength | 100 MPa |
| Notched Izod Impact Strength | 16 J/m |
| Heat Deflection Temperature | 120°C (0.455 MPa) |
| Vicat Softening Temperature | 120°C |
| Glass Transition Temperature | 55-60°C |
| Melting Temperature | 145-155°C |
| Processing Method | Injection molding |
| Melt Processing Temperature | 200-220°C |
| Mold Temperature | 25-55°C |
| Drying Temperature | 80°C |
| Drying Time | 4 hours |
| Biobased Carbon Content | 100% |
| Compostability | Industrial compostable |
As an accredited Ingeo Polylactic Acid (PLA) 6252D factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Supplied in 25 kg moisture-resistant paper bags, palletized and wrapped, labeled with product name, grade, lot number, and handling information. |
| Container Loading (20′ FCL) | 20′ FCL container loaded with Ingeo Polylactic Acid (PLA) 6252D, packaged in 25 kg bags, palletized, securely stowed, and braced. |
| Shipping | Ingeo Polylactic Acid (PLA) 6252D is shipped as non-hazardous solid resin pellets in moisture-barrier bags, foil-lined boxes, or octabins. Typically palletized and shrink-wrapped, it is not regulated for transport. Keep dry, store below 50°C, and avoid excessive heat or moisture during shipping. |
| Storage | Store Ingeo Polylactic Acid (PLA) 6252D in a cool, dry, well-ventilated area within sealed original packaging. Keep below 50°C (122°F), away from direct sunlight, moisture, heat, and ignition sources. Protect from contamination and strong odors. Reseal opened bags promptly, follow first-in, first-out stock rotation, use within the recommended shelf life, and dry before melt processing as the supplier recommends. |
| Shelf Life | Approximately two years when stored unopened in original packaging, cool, dry, below 50°C, and protected from moisture. |
Thin-wall cutlery molded from Ingeo 6252D is processed on high-speed toggle or hydraulic injection molding machines with clamp force typically between 1,000 kN and 3,000 kN and screw L/D ratios from 20:1 to 24:1. The grade is pre-dried to a residual moisture ceiling of 250 ppm in a closed-loop desiccant dryer with a dew point no higher than -40 °C; at moisture levels above 250 ppm, hydrolysis in the melt phase lowers average molecular weight, produces splay at the spoon edge gates, and shifts the melt flow rate upward before the mold fills. Melt temperatures are held between 200 °C and 220 °C, while rear zones are set 10–15 °C lower to avoid premature shear heating. At melt temperatures above 230 °C, residence time must be limited to under 10 min, because random chain scission accelerates and causes a measurable drop in plateau melt viscosity and a reduction in notched Izod impact from the typical 2.5–3.5 kJ/m² range obtained under ISO 180:2023 method 1A on conditioned specimens. Cutlery cavities with wall stock below 2.0 mm require high injection velocity and short shot-to-shot cushion variation below 3 mm to prevent premature gate freeze at pinpoint gates. The unannealed part has a heat deflection temperature of 55 °C at 0.45 MPa per ISO 75-2:2013 method B, so the service boundary for contact with hot foods is below that threshold unless the tooling includes a post-mold annealing station at approximately 100 °C for 20–30 min. Published data for the crystallinity achieved in high-speed cutlery after annealing is limited, however, and annealing thickens the amorphous-to-crystalline transition in thin ribs, so sealing of the final product against hot-liquid use is not supported by the standard grade without validated converter trials.
| Parameter | Threshold | Measurement basis | Observed failure boundary |
|---|---|---|---|
| Residual pellet moisture | ≤250 ppm | Desiccant dryer, dew point -40 °C | Splay and viscosity shift above 250 ppm |
| Melt temperature | 200–220 °C | Reciprocating screw, 20:1–24:1 L/D | Degradation acceleration above 230 °C |
| Heat deflection temperature | 55 °C at 0.45 MPa | ISO 75-2:2013 method B | Hot-food service above this threshold without annealing |
| Melt flow rate | 70–85 g/10 min | ISO 1133-1:2022, 210 °C, 2.16 kg | Upper limit indicates molecular weight loss, lower limit indicates faulty drying |
In closure trials with Ingeo 6252D, the dominant constraint is not short-term torque but creep relaxation of the thread interference over storage periods above 30 days at 40 °C. The grade maintains tensile yield stress near 60 MPa under ISO 527-2:2012 at 23 °C, but viscoelastic recovery after thread engagement is slower than unreinforced polypropylene, and the magnitude of back-off torque loss is design-dependent; published data for this specific closure configuration is limited, so converter-scale trials are required. In practice, closure designs with buttress or fully rounded thread roots reduce stress concentration at the thread flank; deep trapezoidal threads with unradiused roots have shown radial cracking at engagement depths above 0.8 mm in sustained cold-fill conditions. Cold-fill is the only acceptable thermodynamic boundary: at temperatures above 50 °C the amorphous PLA phase begins to soften, and the closure back-off torque can fall below the minimum torque specified by the package standard applied to the intended market. Linerless designs require a hot-tip gate diameter not less than 1.0 mm and mold temperature consistency within ±3 °C across the core and cavity to prevent asymmetric shrinkage that tilts the top bead. Moisture must be held below 250 ppm as in cutlery, but for closures the more severe constraint is color masterbatch carrier type: olefin-carrier concentrates from polypropylene stock can weaken weld lines at the gate, so PLA-carrier masterbatches are specified unless converter data support an alternative. The product cannot be labeled as home compostable or ambient-soil biodegradable; industrial compostability claims require the finished closure to satisfy EN 13432:2000 or ASTM D6400-21, including disintegration and ecotoxicity criteria, and any gasket or liner must be certified separately.
| Application | Standard / regulation | Objective | Boundary |
|---|---|---|---|
| Food-contact cutlery | EU 10/2011, national food-contact inventory | Migration and organoleptic compliance | Requires converter-specific validation on finished article |
| Industrial compostability | EN 13432:2000, ASTM D6400-21 | Disintegration, biodegradation, ecotoxicity | Certified article only; not home compost or soil biodegradable |
| Closure torque retention | ISO 8317:2015 or package-specific standard | Child-resistant and sealing performance | Cold-fill applications only; creep relaxation must be measured |
| Mechanical test conditioning | ISO 291:2008, ISO 527-2:2012, ISO 180:2023 | Moisture and temperature conditioning | Unconditioned specimens give non-representative impact values |
Ingeo 6252D is used for injection molded cosmetic jars and compacts with wall thicknesses between 2.0 mm and 5.0 mm; the processing window becomes narrower as wall thickness increases because the amorphous skin freezes quickly at mold temperatures of 20–30 °C while the core remains molten. Sidewall blush, gate blush, and internal sink marks are the dominant defects recorded on tools with center-gated round jars. If the gate diameter is below 1.2 mm, gate freeze occurs before the packing phase can compensate for the volumetric shrinkage of PLA within a 5.0 mm wall, leaving measurable sink above 0.05 mm on class A visible surfaces. This is a process conflict: raising mold temperature to 40–45 °C reduces blush and sink but begins to introduce haze due to crystal nucleation in the wall; above 50 °C, the typical optical haze of a 2.0 mm plaque increases beyond 10 % under ASTM D1003-21. Molders therefore hold mold temperature below 35 °C for transparent compacts and use profiled packing pressure rather than high pack pressure: the packing profile typically peaks at 60–70 MPa hydraulic pressure and decays over 2–3 s to prevent stress whitening around the gate. For opaque masterbatch systems, a mold temperature of 50 °C and a cycle extension of 8–12 s can reduce sidewall sink but lowers throughput. The material should be dried to 250 ppm maximum moisture before entering the hopper; cosmetic jars present a greater splay surface area than thin cutlery, making moisture-related defects visible across the base and collar even when screw recovery is stable. Dimensional validation of snap-fit closures on jars requires specimens conditioned at 23 °C and 50 % RH for at least 48 h per ISO 291:2008, because dimensional change after demolding can alter snap-fit interference by up to 0.2 % of diameter.
Writing instrument barrels and caps molded from Ingeo 6252D on standard open-nozzle machines take advantage of the high flow rate to fill long cores with wall sections from 1.5 mm to 2.5 mm. The main restriction is not flow length but ejection: PLA at low mold temperature has a lower elongation at yield than impact-modified styrenics, so undercuts and snap arms for cap retention must be radiused at the root and limited to engagement strains below 2 % to avoid stress cracking during assembly. If metal inserts are used for pen clips, the insert must be preheated to 60–80 °C to slow skin solidification around the insert, and published data for this specific insert-molding configuration with 6252D is limited.
In food packaging components such as dry-product scoops, spouts, and tamper-evident bands, Ingeo 6252D is sometimes chosen for its controlled melt flow, but dimensions shift after annealing. Unannealed samples have linear mold shrinkage typically between 0.3 % and 0.6 %, measured according to ISO 294-4:2018; if a converter anneals a scoop at 100 °C for 20 min to raise heat resistance above the unannealed 55 °C at 0.45 MPa HDT B value, anisotropic shrinkage can reduce length by an additional 0.1–0.3 % and can warp flat gates. Tolerances for snap-fit or stacking lugs must therefore be prototyped on the intended tool, not on a universal shrinkage plaque. The annealing station must hold the part in a constrained fixture during heating and cooling because unconstrained annealing of thin spouts produces out-of-flatness above 0.5 mm per 100 mm parting line length. This boundary is process-dependent and published data for Ingeo 6252D under constrained annealing is limited; converter trials are required for dimensional critical features.
Horticultural tags, propagation clips, and plant-support connectors molded from Ingeo 6252D are limited by the combination of high solar surface temperatures and mechanical stress concentration. The unannealed polymer reaches its heat deflection temperature near 55 °C at 0.45 MPa under ISO 75-2:2013 method B; exposed black tag clips can exceed 55 °C in direct sunlight, causing creep and loss of clamping force on stem diameters. Clip hinges or living hinges are not recommended for arbitrary flex cycles because PLA has lower fatigue resistance than polypropylene; a hinge thickness below 0.5 mm may crack within a few thousand cycles if the bending radius creates surface strain above the yield strain of approximately 3 % measured under ISO 527-2:2012. For tags, the grade should be limited to non-structural applications below 50 °C surface temperature, and ultraviolet exposure should be considered: unstabilized PLA will develop gloss loss and chalking, although the embrittlement rate depends on stabilizer package and published data for 6252D in multi-season field exposure is limited. Industrial compostability per EN 13432:2000 applies only to certified finished articles, not to the raw material alone, and these clips should not be described as soil biodegradable at ambient conditions.
Laboratory disposables such as specimen transport cups, non-autoclavable Petri dish lids, and diagnostic accessory housings are injection molded from Ingeo 6252D for transparent, dimensionally stable parts that do not require thermal sterilization. Autoclave cycles at 121 °C or dry heat above 60 °C are outside the service envelope because the unannealed material loses modulus above its 55 °C HDT B value. Gamma irradiation is often used for PLA diagnostic components, but the dose-response of 6252D is not fully covered in public technical literature; converters must validate mechanical property retention after doses in the range of 25–50 kGy under ISO 527-2:2012 tensile testing and ISO 180:2023 impact testing on conditioned specimens. The high melt-flow rate allows filling of thin diagnostic cartridge channels without excessive pack pressure when tooling uses well-vented cavities and a mold temperature of 20–30 °C, but dissolved gases in the melt and moisture above 250 ppm can create microbubbles that compromise optical isotropy in transparent reading windows. For any medical or diagnostic use, the converter must separately determine regulatory status under the applicable device directive or regulation; the grade should not be assumed to carry biocompatibility certifications at the raw-material level.
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NatureWorks Ingeo 6252D is a high-flow polylactic acid (PLA) injection moulding grade supplied as cylindrical pellets. The resin is synthesised from lactide monomer via ring-opening polymerisation and is normally processed directly on injection moulding machines without compounding. The grade is specified at a melt mass-flow rate of 70–85 g/10 min at 210 °C with a 2.16 kg piston load per ISO 1133-1:2022. Density is 1.24 g/cm³ per ISO 1183-1:2019. Tensile yield strength is 60 MPa, tensile modulus is 3.5 GPa, and elongation at break is 3.5% per ASTM D638-14. Notched Izod impact is 16 J/m per ASTM D256-10 on 3.2 mm specimens. Heat deflection temperature under 0.455 MPa flexural load is 55 °C per ASTM D648-16. These values are typical lot-average data from the manufacturer’s technical data sheet and do not constitute batch release limits.
| Property | Test method or condition | Typical value |
|---|---|---|
| Melt mass-flow rate | ISO 1133-1:2022, 210 °C, 2.16 kg | 70–85 g/10 min |
| Density | ISO 1183-1:2019 | 1.24 g/cm³ |
| Tensile yield strength | ASTM D638-14, Type IV | 60 MPa |
| Tensile modulus | ASTM D638-14, Type IV | 3.5 GPa |
| Elongation at break | ASTM D638-14, Type IV | 3.5% |
| Notched Izod impact | ASTM D256-10, 3.2 mm | 16 J/m |
| Heat deflection temperature | ASTM D648-16, 0.455 MPa | 55 °C |
| Mould shrinkage | ISO 294-4:2018 | 0.4–0.6% flow, 0.3–0.5% transverse |
Within the Ingeo injection moulding portfolio, 6252D occupies the high-flow end of the melt-viscosity curve. Compared with 3052D, the grade reduces cavity-fill pressure and permits shorter injection time in thin-wall tools, but the lower melt strength increases sensitivity to gate blush and part warpage when holding pressure is not optimised. Compared with 2003D and 4043D extrusion/thermoforming grades, 6252D is not suited to stable melt-phase stretching because of low elongational viscosity. The resin also differs from nucleated high-heat PLA grades: rapid solidification in chilled tools preserves an amorphous structure and high transparency, but the heat deflection temperature remains 55 °C; service above 50 °C under load causes dimensional distortion. The low crystallinity after rapid cooling is achieved by controlling D-lactide content; the exact D-lactide value is not published in the 6252D technical data sheet. Published multi-grade comparative data for 6252D versus other Ingeo resins are limited to the manufacturer’s current grade-selection charts and certificates of analysis.
Residual moisture is the principal process risk. PLA is a polyester; water above 0.025% by weight (250 ppm) hydrolyses ester linkages during melt processing. The manufacturer specifies desiccant drying at 80 °C for 4 h with a dew point no higher than −40 °C. Outlet moisture should be verified by Karl Fischer titration or a calibrated online dew-point analyser. If hopper residence time exceeds 30 min under warm conditions, moisture regain occurs; at ambient relative humidity greater than 60%, hopper dryers should maintain a closed-loop dry-air purge. Production-scale observations on two-cavity cold runner tools show that moisture above 0.05% produces splay, loss of transparency, and weld-line embrittlement. Published degradation kinetic constants for 6252D at processing temperatures are limited, but the general PLA hydrolysis activation energy is approximately 70–80 kJ/mol; drying above 100 °C for more than 6 h may therefore accelerate molecular weight loss and shift the melt flow rate outside the specification envelope.
Unopened bags should be stored below 50 °C and protected from sunlight. Partially used bags must be re-sealed with desiccant if not consumed within one shift. Pallet stacking above three bags can crush pellets and generate fines; fines accumulating in the hopper throat can bridge and cause feed interruption. The resin is not hygroscopic in the same manner as polyamide, but surface and absorbed water both contribute to hydrolytic chain scission.
Barrel temperature settings should be profiled from 180 °C in the feed zone to 210 °C at the nozzle. Melt temperature measured by a needle pyrometer should remain within ±5 °C of 210 °C. At melt temperatures above 230 °C, lactide reformation and molecular weight decline become detectable as a drop in melt viscosity and an increase in acetaldehyde. At melt temperatures below 195 °C, unmelted pellets can reach the non-return valve and cause shot-weight drift. Screw rotation should be limited to 50–100 rpm with back pressure of 0.3–0.5 MPa to avoid excessive shear heating. A general-purpose reciprocating screw with compression ratio 2.5:1 to 3.0:1 and L/D 20:1 is suitable for neat 6252D; high-shear barrier screws are not required and may generate local temperature spikes.
Transparent thin-wall tools with nominal wall thickness from 0.6 mm to 1.2 mm benefit from the high-flow rheology of 6252D. In a 16-cavity hot-runner lid tool with 0.7 mm sidewalls, the resin fills at lower injection pressure than 3052D; some tooling trials report pressure reductions of approximately 20–30%, but published data for this specific configuration are limited. The exact pressure reduction is tool-specific and should be determined by injection moulding simulation using Autodesk Moldflow or Moldex3D, because hot-runner pressure drop varies with runner diameter, gate geometry, and valve-gate timing. Mould temperature should be set at 15–25 °C to obtain rapid solidification and high transparency. Mould temperatures above 35 °C reduce haze but increase cycle time and may increase dimensional shrinkage variation across cavities. The low thermal conductivity of PLA, approximately 0.13 W/m·K, means cooling time scales with wall thickness squared; for 0.8 mm parts, cooling time is typically 8–12 s on machines with 80–120 t clamp force.
Gate and runner dimensions must accommodate the shear-thinning response of the melt. Pin gates smaller than 0.5 mm may cause excessive shear heating and gate blush; valve-gate systems in hot runners should be set with delayed opening to avoid jetting. Cold sprue bushings with 2.5° taper and nozzle temperature at 210 °C reduce stringing. The mould shrinkage of 6252D is 0.4–0.6% in the flow direction and 0.3–0.5% transverse, which is lower than semi-crystalline polypropylene but higher than amorphous polycarbonate. Ejection should be designed for a stiff, low-elongation material; undercuts and textured surfaces require draft angles of at least 1° per side to avoid scuffing.
In high-cavitation lid packaging, short-term melt-residence stability is critical. The recommended shot size should be 50–80% of machine barrel capacity so that residence time does not exceed 5 min at melt temperature. Longer residence times increase lactide formation and may release volatile acetaldehyde into the cavity. Hot-runner manifold temperatures should be set 5–10 °C below nozzle temperature to reduce polymer degradation in stagnant zones; valve-gate tips with internal heating are preferred over torpedo-gated cold drops. General-purpose screws with check rings that have large ball channels are acceptable, but worn check rings producing backflow above 5% of shot volume cause inconsistent cushion control and cavity-weight variation.
The low notched Izod impact of 16 J/m limits 6252D to packaging, cutlery, and thin-wall articles where impact loading is not severe. Tensile modulus of 3.5 GPa provides stiffness, but the elongation at break of 3.5% means snap-fit features and living hinges should be avoided or designed with large radii. Heat deflection temperature under 0.455 MPa is 55 °C; stacked goods, hot-fill lines, or dishwasher exposure above 50 °C are outside the reliable service boundary. The resin is not a drop-in replacement for polystyrene in hot-vending or microwave-only articles. For food-contact use, the neat resin is covered by the manufacturer’s regulatory data sheet; Table 2 summarises the framework but not the article-specific migration testing, which depends on wall thickness, additive package, and food type.
| Regulatory area | Standard or reference | Status note for neat 6252D |
|---|---|---|
| EU food-contact plastics | EU Regulation 10/2011 | Reference in manufacturer regulatory data sheet; migration testing required for finished article |
| US food-contact resin | FDA 21 CFR 177.1520 | Referenced in manufacturer technical bulletin; conditions of use apply |
| Industrial compostability | EN 13432:2000, ASTM D6400-19 | Neat resin meets mineralisation threshold under industrial composting conditions |
| EU chemicals registration | REACH 1907/2006/EC | Registration status confirmed via supplier safety data sheet |
| Hazardous substances | RoHS 2011/65/EU | Neat resin contains none of the restricted substances above threshold |
The resin is incompatible with basic or amine-bearing additives: catalytic transesterification can shift molecular weight distribution and reduce melt stability. Colorant masterbatches should use PLA carriers with neutral or acid-buffered chemistry; polycarbonate or acrylonitrile-butadiene-styrene carriers create immiscible domains that lower weld-line strength. Regrind is processable at levels up to 30% by weight, but higher regrind fractions increase yellowness index per ASTM E313 and decrease melt viscosity. When regrind exceeds 30%, intermittent gate stringing and acetaldehyde taint have been observed on high-speed packaging lines. Batch-to-batch variation in melt flow rate within the 70–85 g/10 min envelope should be treated as a process-input range; mould-filling simulations should bracket cavity pressure using the upper and lower MFR limits.
On 80–120 t toggle-clamp injection moulding machines with 25 mm diameter general-purpose screws and L/D 20:1, shot-weight drift below 0.2% is not achieved until hopper dryer dew point is maintained below −40 °C and material residence in the feed throat is controlled. Short-shot and gate blush are the typical failure modes at the lower MFR limit; splay and weld-line cracking dominate at the upper moisture limit. No post-mould annealing is required for transparent amorphous parts; annealing at 100 °C for 1 h increases crystallinity but reduces transparency and is not recommended for the clarity applications for which 6252D is specified.