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Luminy Polylactic Acid (PLA) L175

    • Product Name: Luminy Polylactic Acid (PLA) L175
    • Factroy Site: No. 100, Qinhuai Road, Jiangning District, Nanjing, Jiangsu, China
    • Price Inquiry: sales4@ascent-chem.com
    • Manufacturer: Boxa Chemical Group Ltd
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    Specifications
    HS Code 995621
    Product Name Luminy Polylactic Acid (PLA) L175
    Chemical Name Polylactic Acid
    Cas Number 9051-89-2
    Appearance Pellets
    Density 1.24 g/cm³
    Melt Flow Rate 8 g/10 min (210°C, 2.16 kg)
    Glass Transition Temperature 55-60°C
    Melting Temperature 175°C
    Tensile Modulus 3600 MPa
    Tensile Strength 70 MPa
    Elongation At Break 2.5%
    Flexural Modulus 3800 MPa
    Flexural Strength 110 MPa
    Notched Izod Impact Strength 2.5 kJ/m²
    Heat Deflection Temperature 85°C (0.45 MPa)
    Vicat Softening Temperature 150°C
    Renewable Content 100%
    Biodegradability Compostable

    As an accredited Luminy Polylactic Acid (PLA) L175 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Luminy Polylactic Acid (PLA) L175 is packaged in 25 kg moisture-barrier-lined paper bags, palletized and securely wrapped for industrial shipping.
    Container Loading (20′ FCL) 20′ FCL container loaded with Luminy Polylactic Acid (PLA) L175 resin, packaged and securely stowed for ocean transport.
    Shipping Luminy PLA L175 ships as non-hazardous solid pellets in moisture-barrier bags, typically 25 kg sacks, FIBCs, or pallets. It is not regulated for transport by DOT, IMDG, IATA, or ADR. Store cool and dry, away from heat, sunlight, and moisture. Keep packaging sealed until use.
    Storage Store Luminy Polylactic Acid (PLA) L175 in a cool, dry, well-ventilated area, away from direct sunlight, heat, and ignition sources. Keep containers tightly sealed to prevent moisture uptake, which can cause hydrolysis and degrade the resin. Avoid contact with strong acids, bases, and oxidizing agents. Maintain clean, dry handling conditions and follow local regulations for combustible dust and pellets.
    Shelf Life Luminy Polylactic Acid (PLA) L175 has a 24-month shelf life when stored unopened, dry, below 30°C, and protected from direct sunlight.
    Application of Luminy Polylactic Acid (PLA) L175

    Luminy PLA L175 is an extrusion-grade PLA homopolymer with a nominal melt mass-flow rate of 8 g/10 min under ISO 1133-1:2022 at 210 °C and 2.16 kg. A residual moisture content above 250 ppm in the pellets prior to sheet extrusion initiates hydrolytic chain scission at melt temperatures between 190 °C and 205 °C. The degradation mechanism is autocatalytic and results in a measurable rise in melt mass-flow rate, lower melt strength, and visible surface defects in the extruded sheet. Pellets are dried in a desiccant-wheel hopper dryer at 80 °C for 4 h, with supply air at a dew point of −40 °C or lower. Where plant relative humidity exceeds 60 %, a sealed hopper with dry-air purge and a return-air dew point monitor are required. The target residual moisture after drying is below 250 ppm, determined by a Karl Fischer coulometric method in accordance with ISO 15512:2019. Drying beyond 12 h does not improve processing and can generate pellet bridging in large hoppers, especially when the dryer is loaded with more than 300 kg of material per charge.

    Sheet extrusion is performed on a single-screw extruder with an L/D ratio of 30:1 to 36:1 and a barrier screw. The barrel profile is set from 170 °C at the feed throat to 200 °C in the metering zone, while the melt temperature measured by an immersion probe should not exceed 205 °C. Above 210 °C, lactide reformation and acrid odour become detectable in the melt stream. The melt is filtered through a 40/60/40 mesh screen pack before entering a flex-lip sheet die. Die gap is set 10 % to 15 % wider than the final sheet gauge to compensate for neck-in and draw-down. A horizontal three-roll polishing stack is maintained with a top roll at 55–70 °C, a middle roll at 50–65 °C, and a lower roll at 35–45 °C. Excessive roll temperature causes sheet sticking and plate-out; insufficient roll temperature produces curl, low surface gloss, and gauge variation at the sheet edge.

    ParameterSetpoint or rangeMeasurement basis
    Pellet residual moisture<250 ppmISO 15512:2019
    Dryer air dew point−40 °C or lowerDryer dew point sensor
    Drying temperature80 °CThermocouple
    Drying time4 hDryer residence time
    Melt temperature190–205 °CImmersion probe
    Extruder L/D30:1–36:1Machine specification
    Polish roll top/mid/lower55–70 °C / 50–65 °C / 35–45 °CRoll surface probe

    Thermoforming of extruded sheet is conducted at a sheet surface temperature of 95–110 °C. The forming window is narrow: below 90 °C the sheet exhibits stress whitening and plug-assist fracture, while above 115 °C sag becomes unmanageable on single-stage pressure formers. Mould surface temperature is held at 30–50 °C for amorphous parts; a higher mould surface temperature above 90 °C is needed only where in-mould crystallisation is specified. Sheet thickness distribution after forming is controlled by plug speed, plug material, and pre-stretch geometry. The thermoformed containers are stabilised by cooling to below 50 °C before trimming to prevent trim-line dust and stress cracking. In food packaging, EU Regulation (EU) No 10/2011 and the supplier conformity statement apply to the grade; the converter must verify migration limits for each final formulation, including any slip, antistatic, or nucleating additives.

    What Limits Draw Resonance in Biaxially Oriented PLA Film Production?

    Draw resonance in sequential biaxial orientation is governed by the strain-hardening behaviour of the polymer melt and the local draw ratio. With Luminy PLA L175, cast sheet is produced at 200–400 µm and subsequently stretched in the machine direction at 60–75 °C with an MD draw ratio of 2.5–3.5. The transverse direction is drawn in a tenter oven at 65–80 °C with a TD draw ratio of 3.0–5.0. Above the upper draw limits, periodic thickness fluctuations propagate from the slow-roll gap and form gauge bands that are visible under polarised light. The use of L175 instead of a low-viscosity PLA reduces draw resonance because the higher melt strength suppresses abrupt necking in the orientation gap. Tenter clip-chain speed and rail geometry must be matched to the strain-hardening rate; mismatched rail opening produces edge thickening and non-uniform shrinkage in the finished roll.

    Annealing at 105–125 °C after orientation fixes crystal orientation and controls residual shrinkage. Shrinkage force is measured on a shrink-force tester in accordance with ISO 14616:1997, where applicable; tensile properties are measured by ISO 527-3:2018 and ASTM D882-18. The oriented film remains dimensionally stable only below 60 °C under load; at higher use temperatures the reverse shrinkage of the amorphous tie-chain fraction becomes measurable. For shrink-label applications, the film is normally supplied with a controlled shrink initiation at 60–70 °C. Published data for L175 in full-shrink label conversion is limited, so pilot-line screening with the specific tenter profile is necessary before release to production.

    Monofilament Extrusion for Fused Filament Fabrication Requires a Two-Zone Cooling Profile

    The monofilament line starts with a single-screw extruder with an L/D of 25:1 to 30:1, fitted with a melt gear pump to smooth pressure fluctuations. Melt temperature at the die is held between 185 °C and 195 °C. The die orifice is substantially larger than the finished filament: a 2.0 mm orifice is typical for 1.75 mm filament, and a 3.0 mm orifice for 2.85 mm filament. The extrudate is passed through a two-zone water bath: the first zone is held at 20–30 °C to set the surface, and the second at 30–40 °C to allow relaxation before winding. A dual-axis laser gauge controls diameter to ±0.05 mm in a closed loop by adjusting the puller speed. Winding tension is controlled by a dancer system; excessive tension introduces ovality and residual stress that causes filament buckling during print feeding.

    The dried resin must meet the same residual moisture target of 250 ppm; undried pellets produce surface roughness and internal voids in the filament. In fused filament fabrication, PLA L175 is printed at a nozzle temperature of 210–220 °C, with a heated bed at 20–60 °C and a print speed of 40–80 mm/s. Part strength is anisotropic: tensile specimens printed flat against the bed commonly show higher values than those printed vertically, and testing under ISO 527-2:2012 is affected by raster direction and infill density. Post-print annealing at 80–110 °C for 1–2 h increases crystallinity and can shift the heat deflection temperature upward, but published data for annealed L175 printed parts is limited and must be generated on the target printer before design validation.

    Stored filament re-absorbs atmospheric moisture, particularly above 60 % RH. After 24 h of exposure at 23 °C and 85 % RH, PLA filament can develop measurable embrittlement and surface artefacts during extrusion. Dry-box storage below 15 % RH is recommended for production printing runs longer than 8 h. Spools that have exceeded the exposure limit are dried in forced-air ovens at 45–50 °C for 4–6 h before re-use, but repeated drying cycles reduce filament ovality tolerance and can alter surface friction in Bowden feed systems.

    In thick-wall technical parts, cutlery, and rigid containers, injection moulding of Luminy PLA L175 is confined to short-shot-free designs where the extrusion-grade melt viscosity does not create filling defects. The resin is dried to below 250 ppm residual moisture and melt processed at 180–200 °C, with a barrel profile rising from 160 °C in the rear zone to 190 °C at the nozzle. A conventional cold-runner tool with a surface temperature of 25–50 °C produces amorphous mouldings. Cycle time is set by cooling below the glass transition; ejection before the part reaches 55 °C can create gate deformation, sink marks, and post-mould warpage. Holding pressure is set between 50 MPa and 80 MPa, and screw back pressure is kept low to avoid excessive shear heating. Shrinkage under ISO 294-4:2018 is typically reported in the range of 0.3–0.5 % parallel to flow and 0.4–0.6 % perpendicular to flow; the exact values depend on gate size, packing time, and wall thickness.

    When crystalline heat resistance is required, the mould surface temperature must exceed 90 °C to initiate slow crystallisation, but this can extend cycle time beyond 60 s for thick sections. L175 is not a fast-crystallising injection grade. Nucleating agents are necessary for in-mould crystallisation, and their addition alters the viscosity curve and the shrinkage anisotropy. Published data for this specific configuration is limited, so tool trials with cavity pressure transducers are required to confirm fill behaviour and shrinkage compensation before mould texturing or dimensional tolerance release.

    Blown Film Bubble Stability, Melt Strength, and Internal Air Cooling

    In blown film, bubble stability is controlled by extensional viscosity at the freeze line. Luminy PLA L175 is processed on a conventional blown film die with a die gap of 0.8–1.2 mm and a melt temperature of 180–195 °C. The melt temperature is kept below 200 °C to preserve melt strength and limit lactide evolution. A blow-up ratio of 2.0–3.0 and a frost line height of 2–4 die diameters are used where the bubble is supported by internal bubble cooling. The IBC air temperature is maintained at 10–20 °C to stabilise the neck; without IBC, low melt strength leads to bubble whip and gauge variation that are not recoverable in the final roll. The extruder must be purged with dried resin; moisture above 250 ppm reappears as gel-like fisheyes and localised melt fracture in the film.

    Standalone PLA film from L175 is stiff and has low dart drop. Tear initiation is low by ISO 6383-2:1983, and dart impact is measured by ISO 7765-1:1988. For compostable bag and liner structures, L175 is blended with PBAT or PBS at 20–50 wt%, but PLA and PBAT are immiscible and require a reactive compatibiliser to stabilise the interface. The operator must not use amine-based processing additives in this system because they can accelerate PLA chain scission and shift the melt mass-flow rate outside the specification. Industrial compostability of the final film must be re-certified under EN 13432:2000 because blending modifies disintegration performance; a neat PLA certification does not transfer automatically to the modified film structure.

    When PLA L175 Serves as a Bio-Based Carrier Resin in Colour Masterbatch

    Masterbatch carriers must match the host resin viscosity to prevent letdown defects. Luminy PLA L175 is compounded on a co-rotating twin-screw extruder with an L/D of 40:1, using a temperature profile from 160 °C in the feed zone to 190 °C at the die. Pigment loading between 30 wt% and 60 wt% is fed through a side stuffer; organic pigments are introduced downstream to limit thermal degradation. Vacuum venting at −0.08 MPa removes residual volatiles and moisture released from the pigment surface. The compounded carrier is strand-pelletised after water cooling to below 45 °C. Dispersion quality is evaluated by a filter pressure test under EN 13900-5:2005; a pressure increase greater than 0.5 bar/g over the test indicates unacceptable agglomerates and requires a screw-design adjustment or a second pass.

    The letdown ratio in moulding or sheet extrusion is 2–4 wt%, depending on pigment strength. If the masterbatch carrier is not dried to below 250 ppm residual moisture, the entire host system carries excess moisture into the melt stream and triggers the same hydrolytic degradation mechanism that affects the neat resin. The addition of external slip agents or nucleating agents in the carrier must be validated against the final compound because they shift the crystallisation temperature measured by ISO 11357-3:2018 and can alter thermoforming process windows. In particular, carrier-formulation changes that reduce the cold-crystallisation peak below the preheating zone setpoint create premature crystallinity and reject thermoformed parts.

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    Certification & Compliance
    More Introduction

    Luminy® Polylactic Acid (PLA) L175 is an unfilled poly(L-lactic acid) homopolymer supplied by TotalEnergies Corbion in pellet form for injection molding and sheet extrusion where low melt-flow index and elevated crystalline melting point are required. The material is designated under ISO 1043-1 as PLA. Its typical melt flow rate is reported by the producer under ISO 1133-1 at 210 °C with a 2.16 kg load as approximately 3 g/10 min; this low-flow value is intentional for high melt strength and is not an indication of degraded viscosity. Density determined by ISO 1183-1 is approximately 1.24 g/cm³. The polymer backbone contains ester linkages; hydrolytic chain scission in the melt is the dominant degradation mechanism when moisture is present. Pre-drying to a residual moisture level below 250 ppm is therefore required before processing, and hopper systems should deliver dry air with a dew point at or below −40 °C.

    Thermal analysis by differential scanning calorimetry under ISO 11357-3 places the glass transition near 60 °C and the melting endotherm near 175 °C. The higher melting endotherm relative to general-purpose PLA grades with melting peaks in the 150 °C to 160 °C range narrows the usable melt-temperature window. Barrel set points above 210 °C are permissible only for short residence times, while zones above 230 °C accelerate thermal degradation and lactide reformation. A flat temperature profile from rear to nozzle is preferred, with the front zone held between 190 °C and 210 °C. Injection-molded tensile bars tested according to ISO 527-2 typically exhibit tensile strength near 60 MPa, tensile modulus near 3500 MPa, and elongation at break below 5%; notched Izod impact strength determined under ISO 180/A is generally below 3 kJ/m² in unmodified form. These values place L175 among stiff, brittle, unfilled PLA homopolymers and explain why impact modification or orientation is needed in applications requiring ductility.

    Representative published values for Luminy PLA L175
    PropertyTest methodTypical value
    DensityISO 1183-11.24 g/cm³
    Melt flow rateISO 1133-1 at 210 °C, 2.16 kgapproximately 3 g/10 min
    Glass transition temperatureISO 11357-2approximately 60 °C
    Melting peak temperatureISO 11357-3approximately 175 °C
    Tensile strengthISO 527-2approximately 60 MPa
    Tensile modulusISO 527-2approximately 3500 MPa
    Elongation at breakISO 527-2below 5%
    Notched Izod impact strengthISO 180/Abelow 3 kJ/m²

    What distinguishes L175 from higher-flow Luminy PLA grades?

    Compared with L105 and L130, L175 provides lower melt flow and a higher melting endotherm. L105 and L130 are general-purpose grades with melt flow rates at or above 10 g/10 min under comparable ISO 1133-1 conditions, making them more suitable for thin-wall injection molding and fiber spinning. L175 is not impact-modified; impact-modified PLA compounds containing elastomeric phases or mineral fillers show higher notched Izod values but sacrifice transparency and stiffness. The unfilled homopolymer structure of L175 retains optical clarity in amorphous molded parts, but quiescent crystallization can generate haze if mold temperatures exceed 90 °C or if annealing is conducted without dimensional constraint. The higher melt strength of L175, inferred from the low melt-flow index, improves sheet sag resistance during extrusion and thermoforming but raises pressure drop in hot-runner systems and requires larger gate cross-sections than L130 at identical wall thickness.

    Drying, melt temperature, and crystallization kinetics during screw processing

    Desiccant drying at 80 °C for 4–6 h is the standard boundary condition for L175. In high-humidity production environments above 60% RH, drying time should be extended to 8 h and the hopper should be blanketed with nitrogen or dried air. Residual moisture above 250 ppm produces a measurable reduction in melt viscosity and releases lactide odor at the die. On a co-rotating twin-screw extruder with L/D 40:1, a barrel profile from 180 °C to 205 °C, screw speed 150–250 min⁻¹, and throughput adjusted to maintain specific mechanical energy input below 0.20 kWh/kg avoids thermal excursions beyond 220 °C. Vacuum devolatilization at −0.08 MPa is applied downstream of the mixing zone to remove residual moisture, unreacted lactide, and low-molecular-weight volatile species.

    Processing boundary conditions for Luminy PLA L175
    ParameterBoundaryProcess definition
    Pre-drying temperature80 °CDesiccant dryer
    Pre-drying time4–6 h; 8 h above 60% RHClosed drying hopper
    Residual moisturebelow 250 ppmKarl Fischer titration / ISO 15512
    Barrel temperature180–210 °CInjection molding or extrusion zones
    Melt temperature at nozzle or die195–210 °CMelt pyrometer
    Mold temperature, amorphous part20–30 °CWater chiller
    Mold temperature, crystallized part95–110 °COil or pressurized water thermolator
    Annealing temperature100–120 °CForced-air oven
    Annealing time for 2 mm wall15–30 minConstrained fixture

    Injection molding of L175 on hydraulic or electric machines with clamping force in the 800–2000 kN range requires a melt temperature of 195–210 °C, and a mold temperature of 20–30 °C for amorphous transparent parts. For crystallized, high-heat parts, the mold is held at 95–110 °C for a minimum of 20 s to allow spherulitic growth, then the part is ejected below 60 °C. Low mold temperatures freeze the polymer into an amorphous state and produce the highest transparency, but heat deflection temperature remains low. Crystallization produced by high mold temperatures raises the heat deflection temperature but reduces clarity and increases shrinkage anisotropy. Shrinkage measured according to ISO 294-4 is approximately 0.4% to 0.6% in flow direction and 0.5% to 0.8% in transverse direction for amorphous molded specimens; annealed crystalline parts can show additional post-mold shrinkage of up to 0.3%. The low melt-flow index of L175 increases injection pressure and shear heating. In thin-wall parts below 1.5 mm nominal wall thickness, flow-length-to-thickness ratios above 150:1 may require melt temperatures at the upper limit of the range and injection velocities above 100 mm/s. Hot-runner systems should avoid dead spots and use externally heated manifolds; internal hot-runner drops with small clearances can generate local temperatures above 230 °C due to shear heating.

    In rigid single-serve coffee capsules, L175 is processed as an injection-molded cup with a sidewall thickness of 0.8–1.2 mm. The mold uses a cold runner and multiple submarine gates to balance filling; cavity pressure transducers record peak pressure near 40 MPa and ensure the pressure at the end of fill remains above 10 MPa. Because the capsule is exposed to hot water at 90–95 °C, the part is annealed after demolding at 100 °C for 15–30 min to raise its heat deflection temperature beyond 90 °C under 0.45 MPa load. Without annealing, the same part exhibits softening at temperatures above 60 °C and is not suitable for hot-fill service. Published data for this specific configuration is limited; the values are derived from standard PLA processing practice and should be confirmed on the specific tool.

    When annealing moves heat deflection temperature beyond commodity PLA values

    Heat deflection temperature of unannealed L175 under 0.45 MPa load measured by ISO 75-2/B is typically below 65 °C, while 1.80 MPa HDT-A values remain below 55 °C. These values are not service temperature limits for annealed parts. After constrained annealing at 100–120 °C, the crystalline fraction increases and the HDT-B value can exceed 90 °C; published values for high-heat PLA grades after optimized annealing range from 90 °C to 105 °C at 0.45 MPa. Annealing below 90 °C produces only limited crystallinity, while annealing above 120 °C risks dimensional distortion and surface exudation of lactide. The part must be supported during annealing because PLA softens near 60 °C before cold crystallization begins. For a 2 mm wall section, a 20–30 min hold at 100 °C is typically sufficient; thicker sections require longer soak intervals and may develop a skin-core crystallinity gradient. The annealing fixture should constrain flatness and circularity, and cooled air should be used to bring parts below 50 °C before stacking.

    In extruded sheet for thermoforming, L175 is processed on a single-screw extruder with grooved feed section, L/D 30:1, and barrier screw geometry. Melt temperature at the die is held at 200–210 °C. The sheet is calendered at 30–50 °C to inhibit premature crystallization. Thermoforming of L175 sheet requires sheet surface temperature near 90–110 °C; below 80 °C the sheet fractures, and above 120 °C it sticks to the mold. Plug-assisted thermoforming with aluminum tooling heated to 100 °C is used for deep-draw containers. The low melt-flow index of L175 provides higher melt strength than high-flow PLA grades, which resists sag and improves wall-thickness distribution.

    Regulatory status and food-contact compliance matrix

    Regulatory compliance for L175 depends on the final formulation and the specific conversion conditions. The producer provides a grade-specific declaration of compliance for food-contact applications under Commission Regulation (EU) No 10/2011 and for applicable FDA food-contact clearances; however, the end-use article must still be tested for overall migration and specific migration of low-molecular-weight species. REACH registration applies to the polymer as a registered substance under Regulation (EC) No 1907/2006, and the grade is outside the scope of RoHS Directive 2011/65/EU as an unfilled polyester without heavy-metal pigments. No statement is made here about composting or biodegradation certification; industrial compostability must be verified against EN 13432 or ASTM D6400 for the specific final part thickness and geometry. For medical or pharmaceutical applications, separate biocompatibility testing under ISO 10993 is required, and the grade is not supplied with implant-grade documentation. Contact with strong aqueous bases, amine-based additives, or high humidity above 60% RH without barrier packaging should be avoided because PLA undergoes hydrolytic degradation at rates that increase with temperature and pH.